1、廣泛用于LED藍(lán)寶石襯底、光學(xué)晶體材料、五金零件、模具、導(dǎo)光板、閥片、液壓密封件、不銹鋼等各種材料的單面研磨

2、主軸采用機(jī)械式的上下移動(dòng)。

3、采用齒輪傳動(dòng)，在調(diào)速電機(jī)的驅(qū)動(dòng)下，通過(guò)行星輪的轉(zhuǎn)動(dòng)從而帶動(dòng)太陽(yáng)輪，實(shí)現(xiàn)公轉(zhuǎn)和自轉(zhuǎn)。

4、適用于對(duì)研磨精度要求高的平面。

1.Widely used in single-side grinding of LED sapphire substrates,optical crystal materials,hardware parts,dies,light guide plates,valves,hydraulic seals,stainless steel and other materials.

2.The spindle is moved up and down mechanically.

3.The sun wheel is driven by gear drive and driven by speed regulating motor through the rotation of planetary wheel to realize rotation and rotation.

4.Suitable for planes requiring high grinding accuracy

1、設(shè)備占地面積：1632*1166*2048mm；

2、設(shè)備總重：1450MM

3、電機(jī)規(guī)格：主軸電機(jī)功率2.2KW，修面電機(jī)功率0.2kw/380v3相/50Hz

4、主動(dòng)軸*1，升降立柱*3；

1.Coverage of equipment:1632*1166*2048mm

2.Total equipment weight:1450kg 

3.Motor Specification:spindle motor power 2.2KW,dressing motor power 0.2kw/380v3 phase/50Hz

4.Active Axis*1,Lifting Column*3