1、廣泛用于LED藍(lán)寶石襯底、光學(xué)晶體材料、五金零件、模具、導(dǎo)光板、

閥片、液壓密封件、不銹鋼等各種材料的單面研磨。

2、主軸采用機(jī)械式的上下移動(dòng)。

3、采用齒輪傳動(dòng)，在調(diào)速電機(jī)的驅(qū)動(dòng)下，通過行星輪的轉(zhuǎn)動(dòng)從而帶動(dòng)太陽輪，實(shí)現(xiàn)公轉(zhuǎn)和自轉(zhuǎn)，增加壓力自動(dòng)檢測。

4、適用于對研磨精度要求高的平面。

1.Widely used in single-side grinding of LED sapphires,optical crystal materials,hardware parts,dies,light guide plates,valves,hydraulic seals,stainless steel and other materials.

2.The spindle is moved up and down mechanically,automatic detection of pressure increase

3.The sun wheel is driven by gear drive and driven by speed regulating motor through the rotation of planetary wheel to realize rotation and rotation

4.Suitable for planes requiring high grinding accuracy

1、設(shè)備佔(zhàn)地面積：1225*1085*2554mm；

2、設(shè)備總重：約1200kg；

3、電機(jī)規(guī)格：主動(dòng)軸自轉(zhuǎn)減速電機(jī)：0.75KW；升降立柱伺服電機(jī)：1.5KW*3；

4、主動(dòng)軸*1，升降立柱*3；

1.Coverage of equipment:1225*1085*2554mm

2.Total equipment weight:About 1200kg 

3.Motor Specification:Active Axis Self-rotating Reduction Motor:0.75KW;Lifting Column Servo Motor:1.5KW*3

4.Active Axis*1,Lifting Column*3